IPC-C-105 Сборник стандартов по жестким печатным платам, 41 стандарт, английский язык

Производитель:
IPC (Association Connecting Electronics Industries®)
Модель: IPC-C-105
Артикул: IPC-C-105
Цена:
По запросу
Данный сборник содержит 36 стандартов по проектированию жестких ПП и материалам для их производства.Приобретение сборника позволит вам сэкономить 50% стоимости, по сравнению с покупкой стандартов по отдельности.
Стандарты, вошедшие в сборник:
- IPC-T-50H — Terms and Definitions for Interconnecting and Packaging Electronic Circuits
- IPC-9691A — User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
- IPC-WP/TR-584A — IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies(Correcting the Misunderstandings on "Halogen-Free")
- IPC-4562A — Metal Foil for Printed Board Applications
- IPC-4811 — Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
- IPC-4781 — Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink
- IPC-7351A — Generic Requirements for Surface Mount Design and Land Pattern Standard
- IPC-4563 — Resin Coated Copper Foil for Printed Boards Guideline
- IPC-2221A — Generic Standard on Printed Board Design
- IPC-2222 — Sectional Design Standard for Rigid Organic Printed Boards
- IPC-2226 — Sectional Design Standard for High Density Interconnect (HDI) Boards
- IPC-2251 — Design Guide for the Packaging of High Speed Electronic Circuits
- IPC-2252 — Design Guide for RF/Microwave Circuit Boards
- IPC-2316 — Design Guide for Embedded Passive Device Printed Boards
- IPC-2615 — Printed Board Dimensions and Tolerances
- IPC-4101B — Specification for Base Materials for Rigid and Multilayer Printed Boards - Includes Amendments 1 & 2
- IPC-4412A — Specification for Finished Fabric Woven from "E" Glass for Printed Boards
- IPC-4552 — Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
- IPC-4553 — Specification for Immersion Silver Plating for Printed Circuit Boards
- IPC-4554 — Specification for Immersion Tin Plating for Printed Circuit Boards
- IPC-4761 — Design Guide for Protection of Printed Board Via Structures
- IPC-4821 — Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
- IPC-6011 — Generic Performance Specification for Printed Boards
- IPC-6012B — Qualification and Performance Specification for Rigid Printed Boards - Includes Amendment 1
- IPC-6018A — Microwave End Product Board Inspection and Test
- IPC-A-600G — Acceptability of Printed Boards
- IPC-D-325A — Documentation Requirements for Printed Boards
- IPC-DR-570A — General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards
- IPC-DR-572A — Drilling Guidelines for Printed Boards
- IPC-JP002 — JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
- IPC-J-STD-003B — Solderability Tests for Printed Boards
- IPC-ML-960 — Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards
- IPC-MS-810 — Guidelines for High Volume Microsection
- IPC-SM-840D — Qualification and Performance Specification of Permanent Solder Mask
- IPC-TR-486 — Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
- IPC-TR-579 — Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
Сборник доступен в печатном виде.
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