IPC-C-105 Сборник стандартов по жестким печатным платам, 41 стандарт, английский язык

Данный сборник содержит 36 стандартов по проектированию жестких ПП и материалам для их производства.Приобретение сборника позволит вам сэкономить 50% стоимости, по сравнению с покупкой стандартов по отдельности.

Стандарты, вошедшие в сборник:

1. IPC-T-50H — Terms and Definitions for Interconnecting and Packaging Electronic Circuits
2. IPC-9691A — User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
3. IPC-WP/TR-584A — IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies(Correcting the Misunderstandings on "Halogen-Free")
4. IPC-4562A — Metal Foil for Printed Board Applications
5. IPC-4811 — Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
6. IPC-4781 — Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink
7. IPC-7351A — Generic Requirements for Surface Mount Design and Land Pattern Standard
8. IPC-4563 — Resin Coated Copper Foil for Printed Boards Guideline
9. IPC-2221A — Generic Standard on Printed Board Design
10. IPC-2222 — Sectional Design Standard for Rigid Organic Printed Boards
11. IPC-2226 — Sectional Design Standard for High Density Interconnect (HDI) Boards
12. IPC-2251 — Design Guide for the Packaging of High Speed Electronic Circuits
13. IPC-2252 — Design Guide for RF/Microwave Circuit Boards
14. IPC-2316 — Design Guide for Embedded Passive Device Printed Boards
15. IPC-2615 — Printed Board Dimensions and Tolerances
16. IPC-4101B — Specification for Base Materials for Rigid and Multilayer Printed Boards - Includes Amendments 1 & 2
17. IPC-4412A — Specification for Finished Fabric Woven from "E" Glass for Printed Boards
18. IPC-4552 — Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
19. IPC-4553 — Specification for Immersion Silver Plating for Printed Circuit Boards
20. IPC-4554 — Specification for Immersion Tin Plating for Printed Circuit Boards
21. IPC-4761 — Design Guide for Protection of Printed Board Via Structures
22. IPC-4821 — Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
23. IPC-6011 — Generic Performance Specification for Printed Boards
24. IPC-6012B — Qualification and Performance Specification for Rigid Printed Boards - Includes Amendment 1
25. IPC-6018A — Microwave End Product Board Inspection and Test
26. IPC-A-600G — Acceptability of Printed Boards
27. IPC-D-325A — Documentation Requirements for Printed Boards
28. IPC-DR-570A — General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards
29. IPC-DR-572A — Drilling Guidelines for Printed Boards
30. IPC-JP002 — JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
31. IPC-J-STD-003B — Solderability Tests for Printed Boards
32. IPC-ML-960 — Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards
33. IPC-MS-810 — Guidelines for High Volume Microsection
34. IPC-SM-840D — Qualification and Performance Specification of Permanent Solder Mask
35. IPC-TR-486 — Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
36. IPC-TR-579 — Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

Сборник доступен в печатном виде.